WICHITA, KS, UNITED STATES, February 15, 2026 /EINPresswire.com/ -- Nitride Global, Inc. (NGI), a global leader in ...

The University of Arkansas has received a $3.5 million grant to upgrade its High-Density Electronics Center and become a Power Packaging ...

The federal award enables the High Density Electronics Center to upgrade its equipment and capabilities while conferring status as a Power Packaging Center of Excellence.

The University of Arkansas announced Tuesday (Feb. 17) that it has received $3.5 million from the National Institute of ...

In recent years, advanced packaging has become much more important. While semiconductor manufacturers used to focus primarily on miniaturization and increasing the performance of individual chips, the ...

Advanced packaging technology continues to make waves this year after being a prominent highlight in 2023 and is closely tied to the fortunes of a new semiconductor industry star: chiplets. IDTechEx’s ...

Continued innovation in advanced packaging opens a clearer path to the outcomes the industry prioritizes. By tightening the physical distance between compute, memory, and interconnect, chipmakers ...

The U.S. Department of Commerce today announced the launch of a new federal funding competition that aims to spur the research and development of more advanced computer chip packaging technologies.

Electronic Vehicles (EVs) have been at the center of attention in recent years. With the automotive industry becoming more aligned with sustainable development goals, the focus has shifted toward EVs ...

Flexible hybrid electronics (FHE) has spawned the development of novel packaging techniques to overcome the application limitations of the rigid boards, high-temperature solders, bulky component ...

The field of electronics, particularly integrated circuit (IC) technology, has advanced rapidly in recent years. With the development of 5G/6G mobile technology, semiconductor devices are evolving to ...